- Highly modular 3-axis platform with orthogonal design - Global flatness and straightness reach micrometer level - X-axis High stiffness linear guide rail High dynamic response, non-contact linear motor drive Active air-cooled/water-cooled heat dissipation design - Z-axis Vertical magnetic levitation gravity compensation can achieve high positioning accuracy High rigidity, high-precision guiding design Ultra thin and lightweight design Modular design Vertical maximum support for 30mm mechanical stroke - T-axis 360 ° rotation without pipeline winding Supports wafer adsorption of various specifications such as 12 ', 8', and 6 ' Active air-cooled/water-cooled heat dissipation design Supports maximum ± 0.7mm wafer warpage Maximum support speed 150rpm
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