Multi-axis Precision Alignment Platform

  • 格物光学-多轴精密对位平台.png




    The Goptica Z3T70-04 series - Multi axis Precision Alignment Platform has four independent degrees of freedom, including one rotation axis, one vertical axis, and two swing and tilt correction axes. The Z3T70-04 module has a very compact structure and excellent positioning accuracy and dynamic characteristics, effectively meeting the special requirements for wafer stage motion performance in advanced semiconductor wafer manufacturing and testing processes. Z3T70-04 not only improves the accuracy of the motion system and simplifies the design difficulty for users, but also significantly enhances the reliability and integration of the equipment, reduces the complexity and overall cost of the equipment, and improves cost-effectiveness.


    Product manual: 格物PDF.png

    Features:Mechanical dimension diagram:

    High precision unrestricted rotational motion 

    - Precise adjustment of tips and tiles above ± 0.2 °

    - Unique Maglev Gravity Compensation Technology 

    - Very small axial and radial runout, only ± 1.25 μ m


    格物光学-多轴精密对位平台尺寸1.png 格物光学-多轴精密对位平台尺寸2.png


    Specifications and Parameters


    Z3T70-04

    轴/Axes Name

    Fine Z

    Tip-Tilt

    T

    行程/Travel

    ±2 mm

    ±0.2°

    360°, Infinite

    最大速度/Maximum Speed 

    0.1 m/s


    10 rad/s

    加速度/Maximum Acceleration

    3 m/s^2


    55 rad/s^2

    定位精度/Position accuracy full stroke

    ±0.05 μm

    ±0.75 arcsec

    双向重复精度/Bidirectional repetition accuracy

    ±0.03 μm


    ±0.35 arcsec

    到位稳定性/Typical position stability (3σ)

    ±15 nm


    ±0.08 arcsec

    径向跳动/Radial runout



    ±1.25 μm

    轴向跳动/Axial runout



    ±1.25 μm

    机械特征/Mechanical Specifications

    驱动负载(无负载)/Moving Mass (without payload) 

    7 Kg

    3.2 Kg

    最大负载/Max Load Capacity

    2 Kg(customizable)

    平台质量/Stage Mass

    13 Kg

    外观尺寸/Dimension 

    S262mmx69.5mm(mid stroke position)



    • Customized information

      Multi axis precision alignment platform optional: In the Z3T70-04 product series, optional options are configured that can be selected according to the user's actual application. The optional content includes encoder, T-axis hard limit, control system and other options.

    • Table 1 Encoder Options

      -S1

      Incremental analog optical linear encoder,1Vpp

      -S2incremental digital optical linear encoder,RS422
      -S3

      Absolute optical linear encoder,BISS




  • 格物光学-多轴精密对位平台.png




    Goptica Z3T110-24 Series - Multi axis Precision Alignment Platform has 4 degrees of freedom, providing a rotation angle of 364 °, dual Z-axis, one for coarse adjustment of wafer loading and unloading, one for precision adjustment of focusing, and tip and tilt correction above ± 0.2 °. The Z3T110-24 module provides better tracking error control performance for motion, and its repeatability, motion, and stability time performance all support larger stroke motion. The Z3T110-24 module is mainly used for front-end applications, with priority given to photolithography back-end and wafer production control.


    Product manual: 格物PDF.png

    Features:Mechanical dimension diagram:

    High precision 364 ° rotational motion

    - Precise adjustment of tips and tiles above ± 0.2 °

    - Dual Z-axis design: 

       Coarse Z-axis for wafer transfer and Fine Z-axis for precision focusing 

    - Unique Maglev Gravity Compensation Technology 

    - Very small axial and radial runout, only ± 1.25 μ m



    格物光学-多轴精密对位平台尺寸1.png 格物光学-多轴精密对位平台尺寸2.png


    Specifications and Parameters 


    Z3T110-24

    轴/Axes Name

    Fine Z

    Tip-Tilt

    Coarse Z

    T

    行程/Travel

    ±2 mm

    ±0.2°

    ±5 mm

    364°

    最大速度/Maximum Speed 

    0.1 m/s


    0.1 m/s

    10 rad/s

    加速度/Maximum Acceleration

    1 m/s^2



    55 rad/s^2

    定位精度/Position accuracy full stroke

    校准前indicative value



    ±10 μm

    ±10 arcsec

    校准后calibration

    ±0.02 μm



    ±0.75 arcsec

    双向重复精度/Bidirectional repetition accuracy

    ±0.01 μm



    ±0.35 arcsec

    到位稳定性/Typical position stability (3σ)

    ±15 nm

    ±0.04 arcsec


    ±0.0038 arcsec

    径向跳动/Radial runout




    ±1.25 μm

    轴向跳动/Axial runout




    ±1.25 μm

    偏摆/Yaw

    ±0.5 arcsec




    机械特征/Mechanical Specifications

    驱动负载(无负载)/Moving Mass (without payload) 

    6.2 Kg

    0.5 Kg

    3.2 Kg

    最大负载/Max Load Capacity

    2.5 Kg(customizable)

    平台质量/Stage Mass

    15 Kg

    外观尺寸/Dimension 

    S259.5mmX115.5mm(Vertically in the middle position of the travel)


    Customized information

    Hollow planar two-dimensional precision displacement table optional: In the PLA90 series product series, optional options are configured that can be selected according to the actual application of the user. The optional content includes options such as travel, encoder, high-precision calibration, etc.

    Table 1 Encoder Options
    -S1incremental analog optical linear encoder,1Vpp
    -S2incremental digital optical linear encoder,RS422
    -S3Absolute Optical Linear Encoder,BISS


    Table 2 Travel Options

    -10

    Coarse Z effective travel 10mm

    -20Coarse Z effective travel 15mm



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